MIC-770 V3
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Fanless system featuring the 12/13th Gen Intel® Core™ i CPU socket (LGA 1700) in a compact design
List of features
Socket type for Intel® 12th Gen Core™ i CPUs (LGA1700) paired with the Intel® R680E/H610E chipset.
Wide operating temperature (-20 ~ 60 °C); VGA and HDMI output;
2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power range
Designed for use in challenging environments, ensuring dust protection with an IP40 rating.
Enables FlexIO and iDoor technology, allowing flexible configuration of additional HDMI, DP, DVI, COM port, DIO, and Remote switch IO options.
Compatible with Advantech i-Modules; supports both Advantech SUSIAPI and embedded software APIs.
Compatible with Intel® vPro™/AMT and TPM technologies.
Compatible with the Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOn.
Description
Introducing a compact and robust Fanless System with 12/13th Gen Intel® Core™ i CPU Socket (LGA 1700) and Intel® R680E/H610E chipset. Operating in a wide temperature range (-20 ~ 60 °C), it offers VGA and HDMI outputs, 2 x GigaLAN, 2 x USB 3.2 (Gen2), and 6 x USB 3.2 (Gen1) ports. With an IP40 dust-proof design, it's ideal for harsh environments. This system supports FlexIO, iDoor technology, Intel® vPro™/AMT, and TPM technologies, making it a secure and versatile solution for various industrial applications.
